What is the difference between ceramic, high frequency and ordinary PCB boards? <br> <br>Ceramic substrate is a kind of special PCB board with good thermal conductivity, insulation performance, and high dielectric constant. It is widely used in terminal products in the field of heat dissipation. Commonly used ceramic-based materials include aluminum oxide, aluminum nitride, zirconium oxide, ZTA, silicon nitride, silicon carbide, etc. FR circuit board refers to a circuit with epoxy glass fiber cloth as the main material. So, what is the difference between ceramic circuit board and ordinary PCB board <br> <br>1. The difference between ceramic substrate and PCB board <br> <br>a. Different materials. Ceramic substrate is an inorganic material, and the core is aluminum oxide or aluminum nitride; ordinary PCB board uses FR4 glass fiber board, which is an organic material. Ordinary PCB board can be laminated in multiple layers. LTCC is the mainstream of ceramic multilayer circuit board. The ceramic multilayer process currently being developed by Hitech Circuits Co., Ltd. is different from the traditional method. It uses magnetron sputtering technology to grow a layer of ceramic medium on the ceramic circuit board that has been metallized, and then re-metallizes this layer of medium to make the second layer of circuit. <br> <br>b. The performance and application of ceramic substrates are different. The thermal conductivity of ceramic substrates far exceeds that of ordinary PCB boards. The thermal conductivity of alumina ceramics is ≧25W(m·K), and the thermal conductivity of aluminum nitride ceramics is ≧170W(m·K). They are used in industries with large heat dissipation requirements, such as high-power LED lighting, high-power modules, high-frequency communications, and track power supplies. The thermal expansion coefficient of ceramic substrates is more compatible with silicon wafers, and the product stability is higher. Ordinary PCB boards are widely used, mostly in private commercial products. <br> <br>2. The difference between ceramic substrates and high-frequency boards <br> <br>a. Different materials. Ceramic substrates are made of aluminum oxide or aluminum nitride, while high-frequency boards are mostly made of Rogers, Yalong, polytetrafluoroethylene, etc., with low dielectric constants and fast high-frequency communication speeds. <br> <br>b. Different performance. Ceramic substrates are widely used in cooling sheets and systems, high-power modules, automotive electronics and other fields. High-frequency PCB boards are mainly used in high-frequency communications, aviation, high-end consumer electronics, etc. <br> <br>3. In the field of high-frequency communications involving heat dissipation requirements, ceramic substrates are usually required to be combined with high-frequency PCB boards, such as high-frequency ceramic PCBs. <br> <br>If you want to know ceramic PCBs, please feel freely to contact Cynthia at [email protected]