24 layers high density interconnect pcb (HDI PCB) can meet higher component density and smaller packaging requirements. Through the heat conduction channel and the solid-liquid phase change cavity, the temperature of the circuit board can be effectively reduced, and the service life of the pcb laminate can be improved. The pcb used to reduce size and weight, as well as to enhance electrical performance. Hitech’s high density interconnect pcb mainly uses in cell, Mp3 player, GPS, memory card, PDA, portable game console etc.

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